HEATSINK

  A thermal conductive metal device designed to absorb and disperse heat away from a high temperature object such as a computer processor. According to customers’ demands, CompTake also provides tapping/sand-blasting /laser-graving/printing/diamond cutting process.

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CT HEATSINK with PAD for DDR4

126 x 25 x 0.8 mm (Single)
NO.4020234
Material : Aluminum
Process : Stamping

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CT HEATSINK with PAD for DDR4

127 x 26.7 x 6.3 mm
NO.4020289
Material : Aluminum
Process : Stamping

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CT HEATSINK with PAD for DDR4

126 x 25 x 0.8 mm (single)
NO.4020144
Material : Aluminum
Process : Stamping

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CT HEATSINK with PAD for DDR4

126 x 26.6 x 6.8 mm
NO.4020032
Material : Aluminum
Process : Stamping

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CT VLP-R-DIMM with PAD for DDR3

127 x 14.35 x 5.8 mm
NO.4150010A
Material : Aluminum
Process : Stamping

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CT LR-DIMM with PAD for DDR3 / DDR4

131.75 x 25.65 x 6.17 mm
NO. TOP 315040012 / BTM 315040013
Material : Aluminum
Process : Stamping

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CT FB-DIMM with PAD for DDR3 / DDR4

127 x 22 x 7 mm
NO. TOP 305040010 / BTM 305040011
Material : Aluminum
Process : Stamping

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CT FB-DIMM with PAD

69.2 x 24.94 x 3.9 mm
NO.4030015
Material : Aluminum
Process : Stamping

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CT SO-DIMM with PAD

71.3 x 24.5 x 4.42 mm
NO.4030030
Material : Aluminum
Process : Stamping