A thermal conductive metal device designed to absorb and disperse heat away from a high temperature object such as a computer processor. According to customers' demands, CompTake also provides tapping/sand-blasting /laser-graving/printing/diamond cutting process.
126 x 25 x 0.8 mm (Single)NO.4020234Material : AluminumProcess : Stamping
127 x 26.7 x 6.3 mmNO.4020289Material : AluminumProcess : Stamping
126 x 25 x 0.8 mm (single)NO.4020144Material : AluminumProcess : Stamping
126 x 26.6 x 6.8 mmNO.4020032Material : AluminumProcess : Stamping
127 x 14.35 x 5.8 mmNO.4150010AMaterial : AluminumProcess : Stamping
131.75 x 25.65 x 6.17 mmNO. TOP 315040012 / BTM 315040013 Material : AluminumProcess : Stamping
127 x 22 x 7 mmNO. TOP 305040010 / BTM 305040011Material : AluminumProcess : Stamping
69.2 x 24.94 x 3.9 mmNO.4030015Material : AluminumProcess : Stamping
71.3 x 24.5 x 4.42 mmNO.4030030Material : AluminumProcess : Stamping